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Company: Beijing Zihang Dahui Electronics Co., Ltd.
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Contacts

Room 1501, Block A, Zhichun Building, No. 118 Zhichun Road, Haidian

+86 010-62621986

[email protected]

LGA1700 TDP 200W 1u copper heatsink

HDH Heatsink CPU Cooler 1u Radiator lga1700 TDP 200W cpu heat sink

* Material: Aluminum+Copper

* TDP: 200W

LGA1700-0HV11

cpu cooler Heatsink cpu cooler 1U heat sink Cooler

Power consumption: TDP 200W

CPU hole distance: 78mm*78mm

Model: LGA1700-0HV11
CPU Socket: LGA 1700(square)
Dimensions: 90mm*90mm*25mm
Fin thickness: 0.3mm
Fin spacing: 1.7mm
Power consumption(TDP): 200W
Material: VC heat sink + copper fins
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