S1
Copper Heatsink cpu cooler 1U heat sink
Power consumption: TDP 180W
Model | 00018056 | |
CPU Socket | AMD SP3 ILM | |
Solution | 1U Server and Up ( Passive ) | |
Dimensions | 120.0 x 80.0 x 28.5 mm | |
TDP | 180W | |
Material | AL Base + Cu Block +AL Fin + Heatpipe | |
Thermal Grease | Dow Corning TC-5218 Pre-Applied |