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Company: Beijing Zihang Dahui Electronics Co., Ltd.
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Contacts

Room 1501, Block A, Zhichun Building, No. 118 Zhichun Road, Haidian

+86 010-62621986

[email protected]

3u heatsink LGA3647 narrow cpu cooler TDP 205W

HDH Heatsink 3u lga 3647 CPU Cooler TDP 205W cpu heat sink

* Material: Aluminum+copper

* TDP:205W

F5

cpu cooler Heatsink cpu cooler 3U heat sink Cooler

Power consumption: TDP 205W

 

Model 00018777
CPU   Socket Intel  FCLGA 3647 Narrow ILM
Solution 3U Server and Up  ( Passive )
Dimensions 108.0 x 78.0 x 98.5 mm
TDP 205W
Material AL Base + Cu Block + AL Fin + 4HP
Thermal   Grease Shin-Etsu X23-7783D Pre-Applied

 

 

 

 

 

 

 

 

 

 

 

 

 

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