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Company: Beijing Zihang Dahui Electronics Co., Ltd.
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Room 1501, Block A, Zhichun Building, No. 118 Zhichun Road, Haidian

+86 010-62621986

[email protected]

2u heatsink LGA1700 cpu cooler TDP 230W

HDH Heatsink 2u lga1700 CPU Cooler TDP 230W cpu heat sink

* Material: Aluminum+Copper

* TDP: 230W

LGA1700-3HV13

cpu cooler Heatsink cpu cooler 2U heat sink Cooler

Power consumption: TDP 230W

CPU hole distance: 78mm*78mm

Model: LGA1700-3HV13
CPU Socket: LGA 1700(square)
Dimensions: 90.0mm*90.0mm*64.0mm
Fin thickness: 0.4mm
Fin spacing: 2.0mm
Power consumption(TDP): 230W
Material: VC heat sink + aluminum fins + 3 heat pipes
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